【英文标准名称】:Mechanicalstandardizationofsemiconductordevices-Part6:Generalrulesforthepreparationofoutlinedrawingsofsurfacemountedsemiconductordevicepackages
【原文标准名称】:半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则
【标准号】:BSEN60191-6-2004
【标准状态】:作废
【国别】:英国
【发布日期】:2005-02-18
【实施或试行日期】:2005-02-18
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:工程图;图例;定义;半导体封装;集成电路;外壳;框架图;标准化;作标记;符号;电气外壳;表面安装;图纸;半导体;架设(施工作业);SMD;设计;电子设备及元件;半导体器件;轮廓图;规则;尺寸;力学;电子工程;电气工程
【英文主题词】:Casedrawing;Definitions;Design;Dimensions;Drawings;Electricenclosures;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Enclosures;Engineeringdrawings;Erecting(constructionoperation);Illustrations;Integratedcircuits;Marking;Mechanic;Outlinedrawings;Rules;Semiconductordevices;Semiconductorpackage;Semiconductors;SMD;Standardization;Surfacemounting;Symbols
【摘要】:ThispartofIEC60191givesgeneralrulesforthepreparationofoutlinesdrawingsofsurface-mountedsemiconductordevices.ItsupplementsIEC60191-1and60191-3.Itcoversallsurface-mounteddevices-discretesemiconductorsaswellasintegratedcircuitsclassifiedasformEinClause3ofIEC60191-4.
【中国标准分类号】:L40
【国际标准分类号】:01_100_25;31_240
【页数】:42P.;A4
【正文语种】:英语